• 专利标题:   Manufacturing method of semiconductor device, by forming graphene layer on first substrate, transferring graphene layer from first substrate to second substrate, and forming single-crystalline film on graphene layer.
  • 专利号:   WO2017044577-A1, KR2018051602-A, CN108140552-A, EP3347914-A1, US2018197736-A1, JP2018535536-W
  • 发明人:   KIM J
  • 专利权人:   MASSACHUSETTS INST TECHNOLOGY, MASSACHUSETTS INST TECHNOLOGY
  • 国际专利分类:   H01L021/02, H01L023/532, H01L029/04, H01L029/16, C01B032/186, C01B032/194, C23C014/14, C23C016/01, C23C016/34, C30B025/18, C30B029/02, H01L021/20, H01L021/336, H01L029/786
  • 专利详细信息:   WO2017044577-A1 16 Mar 2017 H01L-021/02 201722 Pages: 57 English
  • 申请详细信息:   WO2017044577-A1 WOUS050701 08 Sep 2016
  • 优先权号:   US215223P, US335784P, US361717P, US914295

▎ 摘  要

NOVELTY - The method involves forming a graphene layer (120) on a first substrate, transferring the graphene layer from the first substrate to a second substrate (130), and forming a single-crystalline film on the graphene layer. USE - Manufacturing method of semiconductor device (claimed), such as an LED or a multi-junction solar cell. ADVANTAGE - The graphene layer protects the donor wafer from damage, thus allowing multiple uses and reducing cost. Graphene-based layer transfer can increase or maximize reusability because it creates an atomically smooth release surface. The graphene layer can be reused for multiple growth/exfoliation cycles without the need for a polishing step and without damaging the graphene, due to its mechanical robustness. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a semiconductor device. DESCRIPTION OF DRAWING(S) - The drawing is a cross-sectional view which illustrates a method of fabricating a semiconductor device using a graphene-based layer transfer process. Graphene layer (120) Second substrate (130) Epilayer (140)