▎ 摘　　要

NOVELTY - Preparing an organic substrate composite material comprises (i) covering the reinforcing fiber on the copper foil, coating the adhesive and curing at low temperature to form semi-curing structure; (ii) pre-treating the fiber filler; (iii) implanting the fiber filler into the semi-curing structure in step (i) through an electrostatic flocking method;(iv) preparing filler solution; (v) pouring the prepared filler solution into the semi-curing structure embedded fiber filler step (iii), freezing and drying to obtain stable film structure; and (vi) vacuum curing the stable film structure obtained by step (v) and stripping the copper foil. USE - The method is useful for preparing organic substrate composite material. ADVANTAGE - The method: can adopt the electrostatic flocking technology which enhances the thermal conductivity of the organic substrate, cooperates with the reinforcing fiber to improve the mechanical performance; is simple; and produces organic substrate with excellent strength and thermal conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for an organic substrate composite material, prepared as mentioned above.