• 专利标题:   Thermally conductive polyacrylate pressure sensitive adhesive for electronic device, comprises substrate, release paper layer, and heat-conductive adhesive layer comprising graphene, polyacrylate linear polymer, and solvent.
  • 专利号:   CN107142034-A
  • 发明人:   HE Y, WANG W
  • 专利权人:   UNIV BEIJING CHEM TECHNOLOGY, SHANGHAI DUOXI GRAPHENE MATERIALS TECHNO
  • 国际专利分类:   C08F220/06, C08F220/18, C09J011/04, C09J133/08, C09J007/02, C09J007/04
  • 专利详细信息:   CN107142034-A 08 Sep 2017 C09J-007/02 201777 Pages: 11 Chinese
  • 申请详细信息:   CN107142034-A CN10319552 09 May 2017
  • 优先权号:   CN10319552

▎ 摘  要

NOVELTY - A thermally conductive polyacrylate pressure sensitive adhesive comprises a substrate, a heat-conductive adhesive layer, and a release paper layer. The thickness of the substrate is 10-100 mu m. The thickness of the heat-conductive adhesive layer is 20-100 mu m. The lower surface of the substrate is coated with heat-conductive adhesive layer. The heat-conductive adhesive layer comprises 0.4-1.6 wt.% graphene, 30.4-49 wt.% polyacrylate linear polymer, and 50-68 wt.% solvent. The release layer is formed in lower portion of heat-conductive adhesive layer. USE - Thermally conductive polyacrylate pressure sensitive adhesive for electronic device. ADVANTAGE - The thermally conductive polyacrylate pressure sensitive adhesive has high thermal conductivity and initial viscosity, excellent sticky performance, peel strength, bonding performance, and thermal stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of thermally conductive polyacrylate pressure sensitive adhesive, which involves mixing polyacrylate linear polymer, graphene, and solvent in a different ratio, ultrasonically dispersing, so that the graphene is dispersed in the polymer, coating the ultrasonic-dispersed graphene-polyacrylate mixed solution on the release paper with a wire bar coater, placing the solvent in the oven, drying, and adhering on the substrate.