• 专利标题:   Preparation of flexible and transparent graphene/silicon metal-semiconductor-metal photodetector involves etching silicon thin film of silicon substrate, positioning on both sides of silicon bar, and depositing gold electrode.
  • 专利号:   CN107146830-A, CN107146830-B
  • 发明人:   LI W, LIU W, LV J, MA L, XU Y, E YAZI
  • 专利权人:   UNIV ZHEJIANG, UNIV ZHEJIANG
  • 国际专利分类:   H01L031/108, H01L031/18
  • 专利详细信息:   CN107146830-A 08 Sep 2017 H01L-031/18 201771 Pages: 7 Chinese
  • 申请详细信息:   CN107146830-A CN10423821 07 Jun 2017
  • 优先权号:   CN10423821

▎ 摘  要

NOVELTY - Preparation of flexible and transparent graphene/silicon metal-semiconductor-metal photodetector involves etching silicon thin film of silicon substrate into rectangular silicon bar by deep level reaction etching machine, where silicon substrate comprises silicon thin film and silica isolation layer and silicon substrate; positioning on both sides of silicon bar on surface of silicon dioxide, and depositing gold electrode through electron beam evaporation technique; and preparing monocrystalline graphene film on copper foil substrate by chemical vapor deposition. USE - Method for preparing flexible and transparent graphene/silicon metal-semiconductor-metal photodetector (claimed). ADVANTAGE - The method has simple preparation technology, low cost, high response degree, fast response speed, large internal gain, and small switch ratio. DETAILED DESCRIPTION - Preparation of flexible and transparent graphene/silicon metal-semiconductor-metal photodetector comprises etching silicon thin film of silicon substrate into rectangular silicon bar by deep level reaction etching machine, where silicon substrate comprises silicon thin film and silica isolation layer and silicon substrate; positioning on both sides of silicon bar on surface of silicon dioxide, and depositing gold electrode through electron beam evaporation technique; preparing monocrystalline graphene film on copper foil substrate by chemical vapor deposition; covering upper surface of silicon dioxide insulating layer; and patterning monocrystalline graphene film into interdigitated pattern by photolithography, removing excess graphene by plasma etching, covering patterned monocrystalline graphene film, covering upper surface of patterned device with polycarbonate film, scraping polycarbonate film, and etching silicon substrate in buffered oxide etch.