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  • 专利标题:   Resin compound material for molded products, comprises specified amount of additive having preset solubility parameter, and carbonaceous material having graphene structure with respect to specified amount of polyolefin resin.
  • 专利号:   JP2014162891-A
  • 发明人:   KUSACHI K, TAKAHASHI K
  • 专利权人:   SEKISUI CHEM IND CO LTD
  • 国际专利分类:   C08K007/00, C08L023/00, C08L053/02
  • 专利详细信息:   JP2014162891-A 08 Sep 2014 C08L-023/00 201460 Pages: 12 Japanese
  • 申请详细信息:   JP2014162891-A JP037308 27 Feb 2013
  • 优先权号:   JP037308

▎ 摘　　要

NOVELTY - A resin compound material comprises 0.1-40 pts. wt. carbonaceous material having graphene structure with respect to 100 pts. wt. polyolefin resin, and 0.1-20 pts. wt. additive. The solubility parameter value of additive is (x)-(x+2) (excluding x+2), when solubility parameter value of polyolefin resin is x(cal/cm3)1/2. USE - Resin compound material is used for molded products. ADVANTAGE - The resin compound material has low linear expansion coefficient, and provides molded product having excellent dimensional stability.