▎ 摘　　要

NOVELTY - Graphene substrate comprises a graphene layer (1), where the surface of the graphene layer is covered with an insulating layer (2), and the surface of the insulating layer is a metal circuit topology layer (3). USE - Graphene substrate used for semiconductor power module packaging. ADVANTAGE - The graphene substrate has excellent graphene-conducting characteristics, greatly improve the radiating effect of the module, and reduces the control difficulty of the module packaging method. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the graphene substrate. 1Graphene layer 2Insulating layer 3Metal circuit topology layer