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  • 专利标题:   Graphene dissipation structure for e.g. heat dissipation devices, has substrate containing surfaces, and graphene dissipation layer containing surface-modified graphene nano sheets, carrier resin and filler, in specified weight ratio.
  • 专利号:   US2015313041-A1, CN105015094-A, TW495716-B1, TW201540822-A, CN105015094-B
  • 发明人:   WU M Y, HSIEH C, CHEN J, HSIEH S, LI K, XIE S, WU Y, XIE C, LI G, HSIEH C Y, CHEN J R, HSIEH S L, LI K T
  • 专利权人:   WU M Y, HSIEH C, CHEN J, HSIEH S, LI K, ANJU SCI TECHNOLOGY CO LTD, WU M Y, HSIEH C, CHEN J, HSIEH S, LI K, ENERAGE INC, BEIJING XICHUANG TECHNOLOGY CO LTD
  • 国际专利分类:   H05K007/20, B32B015/08, B32B009/00, B32B009/04, C09K005/14, C01B031/04
  • 专利详细信息:   US2015313041-A1 29 Oct 2015 H05K-007/20 201578 Pages: 6 English
  • 申请详细信息:   US2015313041-A1 US594730 12 Jan 2015
  • 优先权号:   TW115400

▎ 摘　　要

NOVELTY - A graphene dissipation structure has a substrate (10) containing surfaces (I) and (II), and graphene dissipation layer (20) containing 0.1-20 wt.% surface-modified graphene nanosheets (21), 20-80 wt.% filler (25) with ratio of particle size and thickness of 2-100, and 10-50 wt.% carrier resin (23). The surface (I) is contacted with heat source(s), and graphene dissipation layer being thermally conductive is provided on surface (II) of substrate. The surface-modified graphene nanosheets are uniformly dispersed in carrier resin and contact with each other through filler. USE - Graphene dissipation structure used for heat dissipating electrical elements and devices. ADVANTAGE - The graphene dissipation structure has enhanced thermal transfer efficiency by providing additional effective contact area, and excellent thermal and electrical conductivity. DESCRIPTION OF DRAWING(S) - The drawing shows sectional view of graphene dissipation structure. Substrate (10) Graphene dissipation layer (20) Surface-modified graphene nanosheets (21) Carrier resin (23) Filler (25)