▎ 摘　　要

NOVELTY - A molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin; and graphene oxide. USE - The molding composition is used for a semiconductor package (claimed). ADVANTAGE - Provided are molding composition for a semiconductor package including a liquid crystal thermosetting polymer resin and graphene oxide to thus effectively decrease coefficient of thermal expansion and warpage and maximize an effect of thermal conductivity, and semiconductor package using the same. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is a semiconductor package comprising: a printed circuit board on which a semiconductor chip is mounted; and a molding material formed on the printed circuit board, where the molding material is made of the molding composition above; or a semiconductor package comprising a first printed circuit board on which a first semiconductor chip is mounted; an upper package containing a first molding material formed on the first printed circuit board; a second printed circuit board on which a second semiconductor chip is mounted; a lower package containing a second molding material formed on the second printed circuit board; and solder bumps electrically connecting the upper package and the lower package, where the first molding material and the second molding material are made of the molding composition above.