▎ 摘　　要

NOVELTY - A high heat-conducting glue film comprises 500-800 pts. wt. graphene-type boron nitride nano-sheet, 1-10 pts. wt. curing agent, 1-35 pts. wt. toughening agent and 65-100 pts. wt. halogen-free epoxy resin. USE - High heat-conducting glue film. ADVANTAGE - The film has better heat-resistant, voltage-resistant and heat conduction. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for preparing a high heat-conducting glue film, which involves mixing 100-1600 pts. wt. graphene-type boron nitride and dimethyl formamide at a constant temperature for 0.2-15 hours to obtain a dispersed solution, where ratio of graphene-type boron nitride and dimethyl formamide is 1 g:5 ml-1 g:50 ml, carrying out centrifuging process on the solution at 4000-8000 rpm to separate solid particles from the solution followed by drying the solution to obtain a graphene type boron nitride nano-sheet, dissolving curing agent in 10-100 pts. wt. solvent until the curing agent is completely dissolved, dissolving toughening agent with 1-140 pts. wt. solvent until the toughening agent is completely dissolved, mixing halogen-free epoxy resin with the dissolved solutions to obtain epoxy substrate that is added with the graphene type boron nitride nano-sheet to obtain heat-conducting glue, and coating and backing surface of a polyethylene terephthalate release film at 80-110 degrees C for 5-8 minutes in an oven to obtain a finished product.