▎ 摘　　要

NOVELTY - A heat transferable biodegradable substrate (100) comprises a first layer (102) comprising a poly lactic acid (PLA) matrix dispersed with graphene oxide (GO) particles and a second layer (104) comprising the PLA matrix dispersed with boron nitride (BN) particles, where the second layer comprises an electronic circuit (106) made up of copper (II) oxide using a process of physical vapor deposition (PVD). USE - Heat transferable biodegradable substrate used for manufacturing moldable interconnect devices (MIDs) (claimed). ADVANTAGE - The substrate has improved strength and is biodegradable and environment friendly. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing a biodegradable substrate which involves mixing particles selected from GO, BN, and a copper oxide in PLA matrix, forming a wire out of the mixed particles in the PLA matrix using a screw extruder with optimum process parameters such as extrusion temperature, nozzle diameter, and mixing ratio and depositing a first layer and a second layer of the substrate through a multi-jet three-dimensional (3D) printer. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of substrate. Substrate (1) First layer (2) Second layer (3) Electronic circuit (4)