▎ 摘　　要

NOVELTY - Preparing composite copper graphene involves preparing a graphene heat conducting film as a base material, performing regular perforation process on the surface of the base material surface, performing electroplating treatment after fixing the substrate, performing copper deposition on the substrate surface and the through hole to obtain a composite copper film, and rolling the composite copper sheet graphene sheet. USE - The method is useful for preparing composite copper graphene, which is useful in electronic equipment component, e.g. CPU. The graphene composite copper film is useful as high heat-conducting and electromagnetic shielding material. ADVANTAGE - The graphene composite copper film has high heat-conducting and electromagnetic shielding effect. It has light weight, small density, and stable performance. It solves the electronic component of heat and electromagnetic interference. It can be precise adjust and control/metal composite film. The plating layer is compact without peeling, falling phenomenon, and graphene film frame is complete, without damage. When plating copper can be the hole inner wall transverse micro-pore for shallow copper load, high strength rivet effect of graphene film and copper film is realized. The bonding strength of the copper plating surface and the graphene is improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a compound copper graphene. DESCRIPTION OF DRAWING(S) - The drawing shows the present invention provides a high heat-conducting and electromagnetic shielding graphene the composite copper film object picture.