• 专利标题:   Preparing high heat-conducting polyimide film useful in flexible heater comprises e.g. pouring graphene oxide into mixed solution of aromatic diamine, biphenyl dianhydride and dimethylacetamide solution to obtain polyamic acid solution, heating polyamic acid solid film, and forming film.
  • 专利号:   CN113896921-A
  • 发明人:   LI L, CHEN J, TANG X, XU Y
  • 专利权人:   JUAI MAIDE SUZHOU TECHNOLOGY CO LTD
  • 国际专利分类:   C08G073/10, C08J005/18, C08K003/04, C08L079/08
  • 专利详细信息:   CN113896921-A 07 Jan 2022 C08J-005/18 202239 Chinese
  • 申请详细信息:   CN113896921-A CN11317786 09 Nov 2021
  • 优先权号:   CN11317786

▎ 摘  要

NOVELTY - Preparing high heat-conducting polyimide film comprises e.g. taking tetracarboxylic dianhydride and dimethyl diphenyl ether into the inside of the grinding device, mixing, stirring continuously and grinding until tetracarboxylic dianhydride and dimethyl diphenyl ether in powder form, mixing the two mixture of substances, drying, pouring dimethylacetamide solution into the interior of container, heating, and stirring to obtain polyamic acid solution; pouring aromatic diamine and biphenyl dianhydride into pulverizing and grinding device, grinding, pouring the powder mixture of aromatic diamine and biphenyl dianhydride, adding dimethylacetamide solution to interior of container, mixing, stirring, heating, pouring graphene oxide into mixed solution of aromatic diamine, biphenyl dianhydride and dimethylacetamide solution to obtain polyamic acid solution; and heating polyamic acid solid film to volatilization temperature and stretching required for desolvation, and film forming. USE - The method is useful for preparing high heat-conducting polyimide film useful in flexible heater, flexible radiating fin, heating circuit and energy device heat conducting medium with higher use quality. ADVANTAGE - The method has excellent characteristics of common polyimide film, has good uniform thermal conductivity, heat conducting coefficient can reach more than 6 times of the common polyimide film,. DETAILED DESCRIPTION - Preparing high heat-conducting polyimide film comprises (i) taking tetracarboxylic dianhydride and dimethyl diphenyl ether into the inside of the grinding device, mixing, stirring continuously and grinding until tetracarboxylic dianhydride and dimethyl diphenyl ether in powder form, mixing the two mixture of substances, continuously drying, pouring two powder mixtures into the interior of the container, pouring dimethylacetamide solution into the interior of the container, heating by a heating device, and adjusting the temperature of the heating device, continuing to heat the mixture for 20-30 minutes, and stirring while heating to obtain a polyamic acid solution; (ii) pouring the aromatic diamine and biphenyl dianhydride into the pulverizing and grinding device, grinding continuously for 20-30 minutes until the aromatic diamine and biphenyl dianhydride are in powder form, pouring the powder mixture of aromatic diamine and biphenyl dianhydride into the container, adding the dimethylacetamide solution to the interior of the container, continuously mixing, stirring and continuously heating it through the heating device while mixing and stirring, adjusting the temperature of the heating device, heating for 15-20 minutes, placing the graphene inside the grinding device and processed into graphene powder, processing graphene powder into graphene oxide by the hummers method, pouring the graphene oxide into the mixed solution of aromatic diamine, biphenyl dianhydride and dimethylacetamide solution to obtain a polyamic acid solution; (iii) pouring the polyamic acid solution and the polyamic acid solution into the container, adding nano-film to the mixed polyamic acid solution using a heating device, continuously heating until the nano film melts using a stirring device, continuously stirring the mixture for 20-30 minutes, and completely mixing the dissolved nano film with the mixed polyamic acid solution; and (iv) gradually heating polyamic acid solid film to the volatilization temperature and stretching required for desolvation, elongating longitudinally film, and performing finally high temperature treatment to convert the polyamic acid into polyimide and film forming.