▎ 摘　　要

NOVELTY - Gold palladium plating solution comprises 0.3-20 g/l water-soluble gold salt, 0.1-12 g/l water-soluble palladium salt, 10-20 mg/l graphene quantum dots, 20-30 g/l ethylenediamine, 50-110 g/l complexing agent, 15-25 g/l conductive salt, 15-25 g/l buffer, 25-35 g/l stabilizer and solvent (remaining amount). USE - The gold palladium plating solution is useful for electroplating copper wire, where the copper wire is used in electronic products. No biological data given. ADVANTAGE - The gold-palladium plating solution has high conductivity, wear resistance, strong corrosion resistance, uniform coating distribution, precise size, and aging resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electroplating process using the gold-palladium plating solution.