• 专利标题:   Gold palladium plating solution useful for electroplating copper wiree, comprises water-soluble gold salt, palladium salt, graphene quantum dot, ethylenediamine, complexing, conductive salt, buffer, stabilizer and solvent.
  • 专利号:   CN115182007-A
  • 发明人:   WANG F
  • 专利权人:   SHANGHAI WANSHENG ALLOY MATERIAL CO LTD
  • 国际专利分类:   C25D003/56, C25D007/06
  • 专利详细信息:   CN115182007-A 14 Oct 2022 C25D-003/56 202203 Chinese
  • 申请详细信息:   CN115182007-A CN10421357 21 Apr 2022
  • 优先权号:   CN10421357

▎ 摘  要

NOVELTY - Gold palladium plating solution comprises 0.3-20 g/l water-soluble gold salt, 0.1-12 g/l water-soluble palladium salt, 10-20 mg/l graphene quantum dots, 20-30 g/l ethylenediamine, 50-110 g/l complexing agent, 15-25 g/l conductive salt, 15-25 g/l buffer, 25-35 g/l stabilizer and solvent (remaining amount). USE - The gold palladium plating solution is useful for electroplating copper wire, where the copper wire is used in electronic products. No biological data given. ADVANTAGE - The gold-palladium plating solution has high conductivity, wear resistance, strong corrosion resistance, uniform coating distribution, precise size, and aging resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electroplating process using the gold-palladium plating solution.