• 专利标题:   High thermal conductivity polyimide composite material comprises polyimide resin, modified carbon fiber, carbon nanotubes and graphene.
  • 专利号:   CN108003615-A
  • 发明人:   XIONG P, WANG Y, HUANG H, ZHOU L
  • 专利权人:   CHANGSHA NEW MATERIAL IND RES INST CO LT
  • 国际专利分类:   C08K013/06, C08K007/00, C08K007/06, C08K007/24, C08K009/02, C08K009/04, C08K009/06, C08L079/08, C09K005/14
  • 专利详细信息:   CN108003615-A 08 May 2018 C08L-079/08 201838 Pages: 5 Chinese
  • 申请详细信息:   CN108003615-A CN11201436 27 Nov 2017
  • 优先权号:   CN11201436

▎ 摘  要

NOVELTY - High thermal conductivity polyimide composite material comprises 50-85% polyimide resin, 5-30% modified carbon fiber, 3-10% carbon nanotubes and 3-10% graphene. The carbon nanotubes are copper-plated carbon nanotubes. The modified carbon fiber is coupling agent-modified carbon fiber. USE - High thermal conductivity polyimide composite material. ADVANTAGE - The material improves mechanical properties and thermal conductivity rate to 40-60%. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of the high thermal conductivity polyimide composite material comprising mixing to obtain premix, melting, extruding and pelletizing.