▎ 摘　　要

NOVELTY - Two substrates are bonded by pre-curing thermoset adhesive using radio-frequency energy, where adhesive comprises at least one radio-frequency susceptor and is in adhesive contact with both substrates, and both substrates have different coefficients of thermal expansion; and subjecting the thermoset adhesive to a heat treatment. USE - The method is useful for bonding two substrates for forming bonded assembly (claimed). ADVANTAGE - The radio-frequency pre-cure secures the substrates in an unstressed configuration, thus during the heat-cure step distortion is restricted, and upon cooling, the sub-assembly will tend to return to the starting, stress-minimized state. An advantage of radio-frequency curing is that it allows a manufacturer to cure adhered assemblies at relatively low cost, both for equipment investment and during use, as compared to conventional ovencuring. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) bonding two substrates which involves providing a first substrate and a second substrate, applying a thermoset adhesive between the first substrate and the second substrate, pre-curing the adhesive using radio-frequency energy, and subjecting the thermoset adhesive to a heat treatment; (2) bonding two substrates which involves providing an assembly comprising first substrate and second substrate, and thermoset adhesive in contact with the first and second substrates, where adhesive is pre-cured using radio-frequency energy to a degree of cure of greater than or equal to 0.4, and subjecting the thermoset adhesive to a heat treatment; (3) manufacture of an assembly comprising one or more sub-assemblies, which involves providing at least one sub-assembly comprising first substrate and second substrate, and thermoset adhesive in contact with the first and second substrates, assembling the sub-assembly into the assembly, and subjecting the thermoset adhesive to a heat treatment; and (4) bonded assembly comprising a first substrate and a second substrate bonded together, where the substrates have different linear coefficients of thermal expansion, and a thermoset adhesive between the substrates.