• 专利标题:   Temperature equalizing device for enabling heat source to achieve uniform heat dissipation, has radiation layer that is arranged on second surface of substrate.
  • 专利号:   TW631443-U
  • 发明人:   CHENG C, CHUNG M H
  • 专利权人:   LONG RUI CO LTD
  • 国际专利分类:   F28D015/02
  • 专利详细信息:   TW631443-U 01 Sep 2022 F28D-015/02 202290 Pages: 23 Chinese
  • 申请详细信息:   TW631443-U TW203721 13 Apr 2022
  • 优先权号:   TW203721

▎ 摘  要

NOVELTY - This creation discloses a temperature equalizing device, which is a stacked temperature equalizing device arranged on a heat source to improve the heat dissipation efficiency of the heat source and achieve the purpose of uniform heat dissipation. and a radiation layer; thus, the temperature uniformity device of this creation is mainly designed by a hardware that stacks a radiation layer, a substrate and a plurality of heat-conducting components in sequence, so as to effectively separate or contact the heat-conducting components that are separated from each other and the heat-generating components to be dissipated. The source is in physical contact to transfer the heat generated by the heat source to the large-area radiation layer made of graphene with high thermal conductivity through the substrate in contact with the heat-conducting member, and then transferred to the air. Effectively improve the heat dissipation efficiency of the heat source to achieve uniform heat dissipation, as well as the main advantages of thinning the overall temperature uniformity device.