▎ 摘　　要

NOVELTY - Manufacturing thermal pad, comprises (i) mixing liquid silicone with low coefficient of thermal expansion and thermal deformation and curing agent to obtain a liquid solution; (ii) mixing liquid solution with three types of heat conductive materials including graphite powder, flake graphene and artificial diamond powder and filler which are three types of metal oxides including alumina powder, zinc oxide powder and ferrite powder; (iii) stirring mixture to be uniformly mixed in a vacuum state; (iv) molding dough to obtain thermal pad with a thickness, size and shape using the thermal pad molding machine; (v) cutting and mixing thermal pad into a rectangular shape of a certain standard, and then processing for heat treatment and hardening in which arbitrary shapes are rearranged and connected in a jigsaw puzzle method; and (vi) heat-treating and curing the thermal pad for heat treatment and hardening processed in step (v) in a high-temperature curing furnace. USE - The thermal pad is useful for heat dissipation of small electric and electronic devices, namely small thin-film electrical and electronic devices e.g. portable computers, switching mode power supply (SMPS), communication repeaters, and battery pack. ADVANTAGE - The thermal pad has high thermal conductivity function in vertical and horizontal directions; effectively disperses overheat caused by the use of small thin-film electrical and electronic devices e.g. portable computers, switching mode power supply (SMPS), communication repeaters, and battery pack cooling through a thermal conductive material (TIM) with high thermal conductivity, can increase the reliability of the device and minimizes the shortening of its lifespan; can more effectively disperse local heat generated in electric and electronic devices due to the relatively low thermal conductivity of graphite in vertical and horizontal directions; and has the effect of being able to mass-produce a thermal pad that effectively transfers heat generated from an electrical/electronic device to the outside or a heat sink without using expensive superconducting equipment. DETAILED DESCRIPTION - Manufacturing thermal pad, comprises (i) mixing 20-30 g liquid silicone with low coefficient of thermal expansion and thermal deformation and 0.3-1 g curing agent to obtain a liquid solution which is a constituent of a thermal pad; (ii) mixing the prepared liquid solution with three types of heat conductive materials including graphite powder, flake graphene and artificial diamond powder and filler which are three types of metal oxides including alumina powder, zinc oxide powder and ferrite powder in a ratio of 1:1:3; (iii) placing the mixture mixed of step (ii) into a vacuum stirrer and stirring it to be uniformly mixed in a vacuum state to obtain a dough for manufacturing thermal pad; (iv) molding the dough stirred through a vacuum agitator to obtain thermal pad with a thickness, size and shape for heat dissipation of small electric and electronic device using the thermal pad molding machine; (v) cutting and mixing the thermal pad of step (iv) into a rectangular shape of a certain standard, and then processing the thermal pad for heat treatment and hardening in which arbitrary shapes are rearranged and connected in a jigsaw puzzle method; and (vi) heat-treating and curing the thermal pad for heat treatment and hardening processed in step (v) in a high-temperature curing furnace of 150-200 degrees C. An INDEPENDENT CLAIM is also included for thermal pad manufactured by above.