▎ 摘　　要

NOVELTY - Preparing chip inductor comprises (i) preparing semi-finished product by using soft magnetic alloy powder and enamelled wire through prefabricated soft-magnetic alloy blank, winding, hot-pressing and baking to obtain inductor semi-finishing product, and spraying insulating resin protective material on surface of inductor semiconductor product, (ii) stripping insulating and coating copper wire paint skin on copper electrode of copper-copper electrode prepared in step (i), (iii) coating layer of soldering flux at copper electrodes, and (iv) completely soaking the electrode of convex substrate surface part of the inductor semi-finished product in the liquid electrode material in solder groove, taking out after soaking for certain time, and starting high temperature and high pressure air gun while taking out, leveling the electrode material on surface of inductor semi-finished product, covering layer of electrode material at soldering flux, and realizing electrode leading-out. USE - The method is useful for storing energy, power transmission, processing signal, filtering and electromagnetic compatibility (EMC). ADVANTAGE - The electrode is made by means of hot air leveling after dipping the electrode material, which is simple and convenient, which reduces the production cost, greatly improves the production efficiency, and can obtain more uniform conductive material layer, improves the welding strength of the inductance product, and avoids short circuit, virtual welding and other bad conditions.