▎ 摘　　要

NOVELTY - Preparation of composite low thermal conductivity material involves subjecting outer layer material formed of polyester resin, graphene composite metal system, naphthol phenolic resin, maleic anhydride and nano-porous nickel oxide, intermediate layer material formed of fullerene derivative and cyanate ester, and outer layer material formed of polystyrene, polyphenylene sulfide, hollow alumina, dicyclopentadiene, silicone phenolic resin and polyvinyl alcohol, to film making machine, then placing in mold, and hot-pressing. USE - Preparation of composite low thermal conductivity material (claimed). ADVANTAGE - The method efficiently provides composite low thermal conductivity material having excellent heat resistance, flame retardant property, processing performance and corrosion resistance. DETAILED DESCRIPTION - Preparation of composite low thermal conductivity material involves adding graphene oxide into N,N-dimethyl dodecylamine, stirring at 100 degrees C for 1 hour, adding diphenoxyphosphine and strontium titanate, stirring the mixture for 0.5 hour, adding hexachloroiridium ammonium, stirring for 10 minutes, cooling naturally, obtaining graphene composite metal system, adding polyester resin, graphene composite metal system, naphthol phenolic resin, maleic anhydride and nano-porous nickel oxide to an extruder, extruded at 195 degrees C, processing in film making machine, obtaining outer layer material, adding fullerene derivative to cyanate ester, reacting at 110 degrees C for 20 minutes, adding diethylphenyl phosphate and tetraethoxysilane, reacting for 30 minutes, adding triglycidyl isocyanurate monomer, stirring at 120 degrees C for 2 hours, adding isotridecyl acrylate and polyurea formaldehyde, continuously stirring for 20 minutes, pouring into a mold, cooling, obtaining intermediate layer material, mixing polystyrene, polyphenylene sulfide, hollow alumina, dicyclopentadiene, silicone phenolic resin and polyvinyl alcohol, adding to extruder, extruding at 185 degrees C, obtaining inner layer particles, subjecting outer layer material, intermediate layer material and inner layer material to film making machine, then placing in the mold, and hot-pressing.