• 专利标题:   Multicomponent conductive adhesive barrier used for fabricating photoelectrode structure comprises adhesive layer comprising doped pressure-sensitive adhesive, and conductive barrier layer including carbon or metal-based material, where adhesive layer is doped with silver nanoparticles, copper.
  • 专利号:   US2023114948-A1
  • 发明人:   MANDANI F, AGRAWAL A, FEHR A, WONG M, MOHITE A D
  • 专利权人:   UNIV RICE WILLIAM MARSH
  • 国际专利分类:   H01G009/042, H01G009/048
  • 专利详细信息:   US2023114948-A1 13 Apr 2023 H01G-009/048 202333 English
  • 申请详细信息:   US2023114948-A1 US045710 11 Oct 2022
  • 优先权号:   US254401P, US045710

▎ 摘  要

NOVELTY - Multicomponent conductive adhesive barrier comprises an adhesive layer comprising a doped pressure-sensitive adhesive (PSA), and a conductive barrier layer including carbon or metal-based material. USE - Multicomponent conductive adhesive barrier for photoelectrode structure of photovoltaic cell (PEC) used for direct conversion of abundant feedstocks such as water, carbon dioxide, and nitrogen to fuels using solar energy. ADVANTAGE - The photoelectrode structure has high-efficiency, improved ability to capture and use renewable energy resources like solar energy, and improved photoelectrode performance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: 1. a photoelectrode structure, which comprises: a substrate, a photoabsorbing layer, a multicomponent conductive adhesive barrier, and an electrocatalyst; and 2. a method for fabricating a photoelectrode structure, which involves: applying a photoabsorbing layer to a substrate; preparing an adhesive layer, where the adhesive layers comprises a doped pressure-sensitive adhesive (PSA), and forming a multicomponent conductive adhesive barrier by applying a conductive barrier layer to the adhesive layer. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a p-i-n perovskite solar cell.