• 专利标题:   Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.
  • 专利号:   WO2022197299-A1, TW202237391-A
  • 发明人:   WU K, LI Y, CHANG C H, ZHU X
  • 专利权人:   HEWLETTPACKARD DEV CO LP
  • 国际专利分类:   B05D001/38, B05D005/08, B82Y030/00, C09D133/04, C09D167/00, C09D175/04, C09D005/00, C09D007/60, C09D007/65, G06F001/16, G09G005/00, B32B015/08, B32B033/00, C08F220/18, C09D007/42
  • 专利详细信息:   WO2022197299-A1 22 Sep 2022 C09D-005/00 202285 Pages: 34 English
  • 申请详细信息:   WO2022197299-A1 WOUS022922 18 Mar 2021
  • 优先权号:   WOUS022922

▎ 摘  要

NOVELTY - Coated substrate (100) comprises a substrate comprising a metal or metal alloy, a basecoat layer (120) on the substrate, where the basecoat layer comprises pigment particles and a first one-part thermally cured polymeric resin, and an anti-fingerprint topcoat layer (130) on the basecoat layer, where the anti-fingerprint topcoat layer comprises a second one-part thermally cured polymeric resin and an anti-fingerprint material comprising a fluoropolymer, a silane, or their combinations, and the basecoat layer is cured before applying the anti-fingerprint topcoat layer on the basecoat layer. USE - The coated substrate is used for an electronic device including a display, a personal computer, a laptop computer, a tablet, a media player, a smart device, a keyboard, or their combinations (all claimed). ADVANTAGE - The coated substrate has excellent hardness and useful anti-fingerprint and anti-smudge properties. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: a method for producing the coated substrate for an electronic device comprising applying a waterborne one-part basecoat composition on a substrate to form a basecoat layer, where the basecoat composition comprises a first thermally curable polymeric resin and pigment particles, heating the basecoat layer to cure the first thermally curable polymeric resin, applying a waterborne one-part topcoat composition onto the basecoat layer to form a topcoat layer, and heating the topcoat layer to cure the second thermally curable polymeric resin; and an electronic device comprising a housing carrying electronic components of the electronic device. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the coated substrate. 100Coated substrate 110Substrate 120Basecoat layer 130Anti-fingerprint topcoat layer