• 专利标题:   Production of graphene-metal composite film in electromagnetic shielding and absorbing applications, involves depositing metal nanoparticles on graphene oxide film formed using graphene dispersion liquid containing graphene and solvent.
  • 专利号:   CN104210168-A, CN104210168-B
  • 发明人:   GAO C, LI Z, LIU Z, SUN H, XIA Z
  • 专利权人:   ZHEJIANG TANGU SHANGXI MATERIAL TECHNOLOGY CO LTD, ZHEJIANG TANGU SHANGXI MATERIAL TECHNOLO
  • 国际专利分类:   B32B015/02, B32B009/04
  • 专利详细信息:   CN104210168-A 17 Dec 2014 B32B-009/04 201521 Pages: 10 Chinese
  • 申请详细信息:   CN104210168-A CN10457180 10 Sep 2014
  • 优先权号:   CN10457180

▎ 摘  要

NOVELTY - Production of graphene-metal composite electromagnetic shielding film involves mixing 1 pt. wt. graphene and 5-150 pts. wt. solvent, dispersing, obtaining graphene dispersion liquid, extruding resultant product at speed of 10-1000 mL/hour, adding coagulation liquid, curing at 10-80 degrees C for 1-100 seconds, drying, forming high-strength graphene oxide film, and depositing metal nanoparticles on both sides of the high-strength graphene oxide film with thickness of 0.01-1000 mu m by physical or chemical plating deposition process. USE - Production of graphene-metal composite film used in electromagnetic shielding and absorbing applications. ADVANTAGE - The method enables production of graphene-metal composite electromagnetic shielding film having adjustable thickness and size, micro-structural regularity, and excellent electroconductivity. DETAILED DESCRIPTION - Production of graphene-metal composite electromagnetic shielding film involves mixing 1 pt. wt. graphene and 5-150 pts. wt. solvent, dispersing, obtaining graphene dispersion liquid, extruding resultant product at speed of 10-1000 mL/hour, adding coagulation liquid, curing at 10-80 degrees C for 1-100 seconds, drying, forming high-strength graphene oxide film, and depositing metal nanoparticles on both sides of the high-strength graphene oxide film with thickness of 0.01-1000 mu m by physical or chemical plating deposition process. The metal nanoparticles contain gold, silver, aluminum, copper, iron, zinc, chromium, nickel, cobalt, platinum, palladium, iridium, rhodium, ruthenium, titanium, vanadium, magnesium, indium, lanthanum, indium and/or antimony. The physical deposition process is vacuum deposition, sputtering coating process, electric arc plasma plating process, ion plating process and molecular beam epitaxy. The solvent is water, N-methylpyrrolidone, acetone, dimethyl sulfoxide, pyridine, dioxane, N,N-dimethylformamide, N,N-dimethylacetamide, tetrahydrofuran, butanone, ethylene glycol and/or diethylene glycol. The coagulation liquid contains methanol, ethanol, ethyl acetate, n-butanol, ethanediol, cyclohexanone, glycerin, butyl acetate, propylene glycol, n-propyl acetate, acetic acid, isobutanol and/or methyl acetate.