• 专利标题:   Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.
  • 专利号:   WO2021138598-A1, US2021235602-A1, AU2020419333-A1, CA3166359-A1, CN115298273-A, EP4085110-A1, KR2022151607-A, IN202217038135-A, US11553630-B2, JP2023508730-W
  • 发明人:   KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K
  • 专利权人:   NANOTECH ENERGY INC, NANOTECH ENERGY INC, NANOTECH ENERGY INC, NANOTECH ENERGY INC, NANOTECH ENERGY INC
  • 国际专利分类:   C09D163/00, C09D005/24, C09D005/32, H05K001/03, H05K009/00, C01B032/19, C08K003/34, C08L051/06, C09D011/52, H01M004/62, C09D201/00, C09D005/33
  • 专利详细信息:   WO2021138598-A1 08 Jul 2021 C09D-163/00 202162 Pages: 66 English
  • 申请详细信息:   WO2021138598-A1 WOUS067727 31 Dec 2020
  • 优先权号:   US957030P, US957035P, US139804, CA3166359, KR726739, CN80098023

▎ 摘  要

NOVELTY - An electromagnetic shield comprises (a) substrate; (b) conductive additive; and (c) binder incorporated with the conductive additive and deposited on the substrate. USE - An electromagnetic shield for electromagnetic interference shielding devices and materials. ADVANTAGE - The electromagnetic interference (EMI) shields and shield coatings prevent or reduce radio frequency (RF) signals and waves from passing through. The EMI shielding devices can be shaped from greater than or equal to 1 sheets that can be thin, flexible, lightweight, and/or corrosion resistant. Various advantages of the EMI shield include allowing EMI shielding to be efficiently adapted to devices, rooms, vehicles, or other relevant implementations, even when such implementations are not designed for or even originally contemplate EMI shielding. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for formation of electromagnetic shield which involves forming a coating comprising, conductive additive, binder, solvent, surfactant, and defoamer; depositing the coating on a substrate; and drying the coating on the substrate.