• 专利标题:   Porous conductive ink used in electroplating pretreatment technology, comprises graphene, conductive particles, binder, hydrophilic oxide, high boiling point solvent and low boiling point solvent.
  • 专利号:   CN115820039-A
  • 发明人:   ZHENG N, SHAO Z, SUN J, WU B
  • 专利权人:   TAN KAH KEE INNOVATION LAB, UNIV XIAMEN
  • 国际专利分类:   C09D011/03, C09D011/033, C09D011/102, C09D011/52, C25D005/12, C25D005/34
  • 专利详细信息:   CN115820039-A 21 Mar 2023 C09D-011/52 202330 Chinese
  • 申请详细信息:   CN115820039-A CN11708311 28 Dec 2022
  • 优先权号:   CN11708311

▎ 摘  要

NOVELTY - A porous conductive ink comprises 5-15 pts. wt. graphene, 0.5-5 pts. wt. conductive particles, 12-45 pts. wt. binder, 0.5-2 pts. wt. hydrophilic oxide, 0.5-2 pts. wt. high boiling point solvent and 7-30 pts. wt. low boiling point solvent. USE - The porous conductive ink is used in electroplating pretreatment technology (claimed). The porous conductive ink is used in various functional plastic products for electroplating. ADVANTAGE - The porous conductive ink forms a porous structure after drying and the metal is deposited in the micropores after electroplating and provides reliable adhesion by relying on the physical mosaic effect. The conductive ink completes the conductivity after curing and could be electroplated and solves the problem of the pollution of hexavalent chromium in industry. The process is simple, avoids chemical plating and avoids the use of precious metal activation, reduces the cost and the adhesion meets the demand. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) a preparation method of the porous conductive ink comprising mixing graphene, conductive particles, binder, hydrophilic oxide, high boiling point solvent and low boiling point solvent to obtain the porous conductive ink; and (2) an electroplating method comprising coating the porous conductive ink on the substrate and electroplating.