• 专利标题:   Cooling device of three dimensional printer nozzle based on graphene interlayer heat exchange has heating device as columnar structure and cooling interlayer covered on circumferential surface of heating device with at least two layers.
  • 专利号:   CN111633984-A
  • 发明人:   FAN C, YANG S, BAI Y, ZHU M, FANG Y, MENG X, HUANG Y, DUAN C, GU J
  • 专利权人:   UNIV SHANGHAI ENG TECHNOLOGY
  • 国际专利分类:   B29C035/16, B29C064/118, B29C064/20, B29C064/295, B33Y030/00
  • 专利详细信息:   CN111633984-A 08 Sep 2020 B29C-064/20 202076 Pages: 7 Chinese
  • 申请详细信息:   CN111633984-A CN10483644 01 Jun 2020
  • 优先权号:   CN10483644

▎ 摘  要

NOVELTY - Cooling device of three dimensional (3D) printer nozzle based on graphene interlayer heat exchange comprises a heating device as a columnar structure. The heating device is a heat-conducting heating device. A cooling interlayer is covered on the circumferential surface of the heating device with at least two layers, where one layer is a graphene layer attached to the heating device, and the other layer is a radiating pipe layer adhered to the graphene. The radiating pipe is not completely filled with cooling liquid. The boiling point of the cooling liquid is lower than the working temperature of the printer nozzle. The heating device is an aluminum alloy heating device or a copper alloy heating device.The first graphene layer and the second graphene layer are pressed by graphene carbon fibers. The radiating pipe is a stainless steel radiating pipe or a flavone radiating pipe. The cooling liquid is distilled water. USE - Used as cooling device of three dimensional printer nozzle based on graphene interlayer heat exchange. ADVANTAGE - The device solves the traditional water circulation cooling method; transfers heat through convection to cool the nozzle; avoids working in the printer; and produces a lot of vibration when it cools and affect the accuracy of printing. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the cooling device of three dimensional printer nozzle based on graphene interlayer heat exchange.