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  • 专利标题:   Increasing organosilicon resin heat resistance involves polymerizing silica-graphene oxide hybrid composite particle, and distilling under reduced pressure.
  • 专利号:   CN104497577-A
  • 发明人:   HUANG Y, JIANG B, LIU L, WU G, WANG F, ZHANG Q, XIE F, MA L
  • 专利权人:   HARBIN INST TECHNOLOGY
  • 国际专利分类:   C08K003/04, C08K003/36, C08K009/00, C08K009/02, C08K009/10, C08L083/06
  • 专利详细信息:   CN104497577-A 08 Apr 2015 C08L-083/06 201542 Pages: 10 Chinese
  • 申请详细信息:   CN104497577-A CN10721476 03 Dec 2014
  • 优先权号:   CN10721476

▎ 摘　　要

NOVELTY - An organosilicon resin heat resistance is increased by polymerizing silica-graphene oxide hybrid composite particle at 60-100 degrees C for 6-10 hours, and distilling under reduced pressure. USE - Method for increasing organosilicon resin heat resistance (claimed). ADVANTAGE - The resin has high heat performance and easy to get source material. The method is simple.