▎ 摘　　要

NOVELTY - A heat conducting framework with vertical orientation structure comprises heat conducting filler mainly arranged vertically. Through non-solvent-induced phase separation of polymer (A), the heat conducting filler is induced to separate with the polymer (A) phase to obtain vertically oriented polymer A/heat conducting filler porous framework. The heat-conducting framework is compounded with polymer (B) by vacuum infusion or solution filling to form excellent heat-conducting path in the polymer (B) matrix to exhibits high heat conducting performance in the vertical direction. USE - Heat conducting framework with vertical orientation structure used in compact film material (claimed) for electronic device. ADVANTAGE - The heat conducting framework material is compounded with the polymer (B) filled pores to obtain film material with excellent heat conducting property and mechanical property in the vertical direction, can effectively fill the interface between heat source and heat sink in the electronic device, enhances the interface heat transfer, and improves the heat radiating performance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: preparation of heat conducting framework with vertical orientation structure, which involves (S1) adding 10 mL solvent, adding 0.5-1.5 g polymer (A) material, dissolving under corresponding dissolving conditions, adding 0.1-3 g heat conducting filler, stirring to obtain mixed slurry, and (S2) coating the mixed slurry in flat substrate in a specific thickness by blade coating, immersing the wet film into coagulating bath, and carrying out non-solvent induced phase separation to obtain vertically oriented polymer A/heat conducting filler porous framework; and use of heat conducting framework with vertical orientation structure in compact film material, which involves using polymer (B) solution as coagulating bath, and filling polymer (B) in non-solvent-induced phase separation to obtain compact film material with vertical orientation framework.