▎ 摘　　要

NOVELTY - The method involves providing a substrate with a copper cladding layer and drilled holes. The walls and bottom of the holes are modified with reduced graphene oxide. The holes are filled with copper, and a thin flat copper layer (20) is formed over the copper cladding layer. A patterned anti-plating film is formed on the thin flat copper layer to define an area of traces having the width of 3-50 micrometer. The copper is deposited on the area of traces with thicknesses of 5-50 micrometer at a variation of less than fifteen percent through a periodic pulse reverse plating process. The anti-plating film is removed, and the thin flat copper layer and copper cladding layer is etched without depositing the copper. USE - Method for modifying walls and bottoms of the holes with reduced graphene oxide. ADVANTAGE - The fine traces possess superior shapes. The thin flat copper layer is quickly removed without undercut. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a printed circuit board comprises a non-conductive substrate with drilled holes. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional schematic view of a blind vias. Copper layer (20) Non-conducting substrate (30) Via (40)