• 专利标题:   Film coating for heat dissipation of copper foil, aluminum substrate and electronic housing, comprises nano-diamond powder, aqueous resin, low-molecular polyamide, curing agent, coupling agent, metal salt and graphene sheets.
  • 专利号:   CN108003742-A
  • 发明人:   XIE T
  • 专利权人:   XIE T
  • 国际专利分类:   C09D161/06, C09D133/00, C09D183/04, C09D177/00, C09D007/61, B05D005/00, B05D007/24
  • 专利详细信息:   CN108003742-A 08 May 2018 C09D-161/06 201838 Pages: 6 Chinese
  • 申请详细信息:   CN108003742-A CN11421122 25 Dec 2017
  • 优先权号:   CN11421122

▎ 摘  要

NOVELTY - A film coating comprises 15-25 pts. wt. nano-diamond powder, 35-45 pts. wt. aqueous resin, 10-15 pts. wt. low-molecular polyamide, 8-10 pts. wt. curing agent, 12-15 pts. wt. coupling agent, 3-5 pts. wt. metal salt and 5-10 pts. wt. graphene sheets. USE - Film coating for heat dissipation of copper foil, aluminum substrate and electronic housing (claimed). ADVANTAGE - The film coating has improved thermal conductivity, emissivity, heat dissipation efficiency and mechanical properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of film coating, which involves mixing raw materials, stirring uniformly and mixing.