• 专利标题:   Chip micro-cavity photonic integrated chip structure used in optical filter, has first waveguide structure and second waveguide structure that contains micro cavity and coupling lens placed on substrate opposite surface of first waveguide structure not coated with mirror.
  • 专利号:   CN114089473-A
  • 发明人:   HUANG W, YI Y, LEI L, CHEN Z, DONG B
  • 专利权人:   UNIV SHENZHEN TECHNOLOGY
  • 国际专利分类:   G02B006/12, G02B006/13
  • 专利详细信息:   CN114089473-A 25 Feb 2022 G02B-006/12 202234 Chinese
  • 申请详细信息:   CN114089473-A CN11405757 24 Nov 2021
  • 优先权号:   CN11405757

▎ 摘  要

NOVELTY - The structure has a first waveguide structure (1), a second waveguide structure (2), a mirror, a coupling lens (4) and a substrate. The first waveguide structure and the second waveguide structure are placed on the substrate. The surfaces coated with the mirrors in the first waveguide structure and the second waveguide structure are opposite to each other. The first waveguide structure and the second waveguide structure both contain micro cavity. The coupling lens is placed on the substrate opposite the surface of the first waveguide structure that is not coated with the mirror. USE - Chip micro-cavity photonic integrated chip structure used in optical filter, optical frequency fluffer and optical sensor for use in optical communication and optical sensing application. ADVANTAGE - The method simplifies the manufacturing process of the optical coupling lens and the optical waveguide micro-cavity structure are integrated on the sheet structure. The method improves the integration degree of the type micro-nano device and optical coupling efficiency of the device, using the laser double-photon polymerization process to realize the manufacturing of the waveguide structure. The etching and coating process, is simple. The method is simplified and the efficiency of method is improved, because the process is a process of direct three-dimensional (3D) printing different from the semiconductor lithography. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a preparation method of on-chip micro-cavity photonic integrated chip. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of an on-chip microcavity photonic integrated chip. First waveguide structure (1) Second waveguide structure (2) Reflector (3) Coupling lens (4) Silicon (6)