▎ 摘　　要

NOVELTY - Manufacture of non-metal joints e.g. electroinsulating and semiconducting materials, bonded with copper, involves introducing 5-20 wt.% copper powder, 80-96 wt.% copper oxide nanopowder in the form cupric oxide or cuprous oxide, and 4-20 wt.% reduced graphene oxide, sintering the mixture at 1223-1333K, and using the modified copper for bonding. USE - Manufacture of non-metal joints e.g. electroinsulating and semiconducting material bonded with copper.