▎ 摘　　要

NOVELTY - A vapor chamber (1) comprises upper plate (10') and lower plate (10'') that are metal thin films (10) facing each other, sealing portions (20) formed along edges of opposite surfaces of the upper and lower plates, and a porous metal fiber sheet (30) provided between the upper plate and the lower plate. A working fluid filled inside comprises a low-boiling fluorohydrocarbon having a boiling point (bp) of 25-100° C. The boiling point of working fluid is 1-25° C lower than the maximum temperature during driving of the subject to which the vapor chamber is applied. USE - Vapor chamber used for intensive thermal management of specific components of electronic products such as smartphones, laptops and system on chip (SoCs) of high-definition TV boards, aerospace applications, fuel cells, electric vehicle battery packs and mobile devices. ADVANTAGE - The vapor chamber has excellent flexibility, elasticity, heat diffusion and cooling effect. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of vapor chamber. (Drawing includes non-English language text) 1Vapor chamber 10Metal thin film 10'Upper plate 10''Lower plate 20Sealing portion 30Porous metal fiber sheet