▎ 摘　　要

NOVELTY - The utility model relates to the technical field of mobile phone main board, specifically claims a mobile phone radiating main board based on copper material, comprising a main board main body, the top surface respectively the main board main body is fixedly mounted with a CPU module and a chip integrated module which are adjacently arranged, the surface of the main board main body is fixedly provided with an embedding groove, the inner wall of the embedding groove is clamped with a shielding cover, the inner wall of the shielding cover is respectively mounted with a first heat conducting sheet and a second heat conducting sheet, the bottom surface of the first heat conducting sheet is adhered with the CPU module, the bottom surface of the second heat conducting sheet is adhered with the chip integrated module; the top surface of the shielding cover is bonding with a semiconductor refrigerating sheet. The utility model through the design of the semiconductor refrigerating sheet, heat pipe assembly, the device can effectively finish the radiating operation of the mobile phone main board, and the device in the radiating operation, the passive radiating structure of the traditional mobile phone radiating main board is an active radiating structure.