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  • 专利标题:   Aluminum sandwich composite plate for e.g. semiconductor components, comprises lower aluminum plate, filling layer laminated on lower aluminum plate and formed by mixing aluminum and graphene, and top aluminum plate.
  • 专利号:   KR2017121583-A, KR1910240-B1
  • 发明人:   HONG S T, HUR S H, PARK G D, KIM J R, AHN E Y, VIET T L, KIM S H, BAEG J G, YU K S, NOH H C, SUH H C, TIEN L V
  • 专利权人:   UNIV ULSAN FOUND IND COOP, SEJONG IND CO LTD
  • 国际专利分类:   B23K001/00, B23K103/10, B23K035/02, B32B015/04, B32B015/16, B32B015/20, B32B009/00, B32B009/04
  • 专利详细信息:   KR2017121583-A 02 Nov 2017 B32B-015/04 201804 Pages: 7
  • 申请详细信息:   KR2017121583-A KR050239 25 Apr 2016
  • 优先权号:   KR050239

▎ 摘　　要

NOVELTY - An aluminum sandwich composite plate comprises a lower aluminum plate, a filling layer laminated on the lower aluminum plate and formed by mixing aluminum and graphene, and a top aluminum plate laminated on the surface of the filling layer. USE - Aluminum sandwich composite plate for semiconductor components and aviation components. ADVANTAGE - The aluminum sandwich composite plate has high thermal conductivity and corrosion resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of aluminum sandwich composite plate.