▎ 摘　　要

NOVELTY - A high thermal conductivity type epoxy resin composite material comprises bisphenol type epoxy resin, boron carbide powder, aluminum oxide, glue 107, dibutyltin dilaurate, ethyl orthosilicate, graphene oxide, ethylenediamine, p-toluenesulfonic acid, multi-walled carbon nanotubes, urea, ammonium polyphosphate, cetyltrimethylammonium chloride, methylhexahydrophthalic anhydride, emulsified silicone oil, KH550 (RTM: gamma -aminopropyltriethoxysilane), ethanol, distilled water, dimethylformamide and formalin. USE - High thermal conductivity type epoxy resin composite material for LED bonding layer. ADVANTAGE - The high thermal conductivity type epoxy resin composite material has excellent mechanical properties. DETAILED DESCRIPTION - High thermal conductivity type epoxy resin composite material comprises 22-28 pts. wt. bisphenol A type epoxy resin (E-51), 4-9 pts. wt. boron carbide powder, 3-8 pts. wt. aluminum oxide, 2-4 pts. wt. glue 107, 3-5 pts. wt. dibutyltin dilaurate, 4-7 pts. wt. ethyl orthosilicate, 7-10 pts. wt. graphene oxide, 3-5 pts. wt. ethylenediamine, 4-8 pts. wt. p-toluenesulfonic acid, 4-8 pts. wt. multi-walled carbon nanotubes, 4-8 pts. wt. urea, 3-5 pts. wt. ammonium polyphosphate, 0.5-1 pt. wt. cetyltrimethylammonium chloride, 3-8 pts. wt. methylhexahydrophthalic anhydride, 3-5 pts. wt. emulsified silicone oil, KH550 (RTM: gamma -aminopropyltriethoxysilane), ethanol, distilled water, dimethylformamide and formalin. An INDEPENDENT CLAIM is included for preparation of high thermal conductivity type epoxy resin composite material, which involves (A) drying aluminum oxide and boron carbide powder in drying oven at 90-110 degrees C for 2-3 hours, cooling to room temperature, adding KH550 (RTM: gamma -aminopropyltriethoxysilane) and ethanol, ultrasonically dispersing for 1-2 hours, filtering, vacuum drying, grinding over 100-200 mesh sieve, mixing the obtained mixture with glue 107, dibutyltin dilaurate and ethyl orthosilicate, stirring for 1-2 hours to obtain mixture (i), (B) adding dimethylformamide to graphene oxide in ratio of 1:2-4, mixing with ethylenediamine, ultrasonically processing for 1-2 hours, heating at 110-130 degrees C for 4-8 hours, filtering, washing with alcohol for 3-5 times, drying at 70-90 degrees C, adding bisphenol A type epoxy resin, heating in vacuum chamber at 140-160 degrees C for 2-3 hours, cooling, sealing, (C) mixing the obtained material with p-toluenesulfonic acid, heating at 75-95 degrees C, stirring evenly, dripping dibutyltin dilaurate and distilled water in ratio of 1:2-5, maintaining constant temperature reaction for 3-5 hours, adding multi-walled carbon nanotubes, ultrasonically oscillating for 1-2 hours to obtain mixture (ii), (D) mixing urea and formalin in a ratio of 1:2-4, adjusting pH to 7-8, heating at 70-80 degrees C for 2-3 hours to obtain solution (a), adding ammonium polyphosphate to ethanol in a ratio of 1:3-5, ultrasonically mixing for 1-2 hours, adding solution (a) and cetyltrimethylammonium chloride, mixing, adjusting pH to 4-5, heating at 80-90 degrees C for 2-4 hours, filtering, drying, leaving still to obtain to obtain mixture (iii), (E) mixing mixture (i), mixture (ii) and mixture (iii), adding methylhexahydrophthalic anhydride, ultrasonically dispersing for 1-2 hours, adding emulsified silicone oil at 60-80 degrees C, carrying out vacuum deaeration reaction for 1-2 hours, pouring the obtained mixture to mold, drying at 80-150 degrees C in drying oven, curing for 2-5 hours and naturally cooling to obtain final product.