▎ 摘　　要

NOVELTY - The method involves preparing raw materials. Phenolic resin and epoxy resin are added as printed circuit board (PCB) core material and aluminum material into a pipeline of a spiral extruder. Graphene fiber and glass fiber are stirred and mixed by a stirring structure when the phenolic resin, the epoxy resin and the aluminum are pre-mixed in the pipeline. A PCB plate material is formed and an extruded PCB plate material is cut according to specified specification by a cutter after mixing the phenolic resin and the epoxy resin in a double-screw extrusion mechanism. A cooling structure is utilized to cool and dry the PCB plate material. Plate material solidifying and forming processes are promoted. A cured plate material is provided with an inner layer of phenolic resin, where an outer layer structure is composed of the graphene fiber and glass fiber. USE - Multi-layer PCB plate production process inner and outer layer spiral extrusion line plate forming method. ADVANTAGE - The method enables improving cooling effect of cold flow blown by an air cooler, improving curing efficiency of the PCB plate, performing convection of cold air blown in horizontal direction of multiple groups of through holes to expand a cooling surface of the plate material and causing an air flow unit to guide upwards to blow guide air to an extrusion forming opening of a cutting mechanism and an extruding mold to reflux waste heat of a device main body, thus inhibiting rapid loss of device heat and increasing accuracy and stability of device extrusion formation, and allowing the graphene fiber and the glass fiber to be independently pre-mixed to form a reinforcing system of a PCB plate outer layer structure using a guide of an arc-shaped connecting pipe and a connecting pipe to be uniformly put into a middle pipe body. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a multi-layer PCB plate production process inner and outer layer spiral extrusion line plate forming device. DESCRIPTION OF DRAWING(S) - The drawing shows a front view of a multilayer PCB plate production process inner and outer layer spiral extrusion line plate forming device. Machine body (1) Circulating cooling system (3) Cutting mechanism (4) Extruding mold (5) Suction unit (6) Mixing mechanism (7) Extruding channel (8) Double-screw extrusion mechanism (9)