▎ 摘　　要

NOVELTY - Transferring sheet of graphene to metal contact bump comprises: providing a substrate comprising metal contact bump on a surface of substrate; placing a sheet of graphene on the substrate; aligning imprinter device with respect to the substrate, where the imprinter device comprises imprinter substrate (10) having a front surface that is provided with cavities; lowering imprinter device with respect to the substrate; pushing down imprinter device; lifting up the imprinter device; and removing the unattached graphene sheet portions (15) by cleaning. USE - The method is useful for transferring sheet of graphene to metal contact bump (claimed) that is used in semiconductor package. DETAILED DESCRIPTION - Transferring a sheet of graphene to a metal contact bump comprises: providing a substrate comprising at least one metal contact bump on a surface of the substrate, where the metal contact bumps are surrounded by a passivation layer (2); placing a sheet of graphene on the substrate, where the sheet of graphene covers the metal contact bumps; aligning an imprinter device with respect to the substrate, where the imprinter device comprises an imprinter substrate (10) having a front surface that is provided with at least one cavities through the front surface, each cavity has a rim portion, a number of cavities is at least same as a number of the metal contact bumps, and the imprinter device is positioned so that each metal contact bump is aligned with one of the cavities; lowering the imprinter device with respect to the substrate so that each metal contact bumps becomes enclosed within a corresponding cavity, thus arranging the sheet of graphene such that it is in contact with top and side surfaces of the metal contact bumps; pushing down the imprinter device until each rim portion cuts through the sheet of graphene; lifting up the imprinter device to leave a graphene sheet portion attached to the substrate and covering each metal contact bumps, with unattached graphene sheet portions (15) remaining on the substrate in between metal contact bumps; and removing the unattached graphene sheet portions by cleaning. INDEPENDENT CLAIMS are also included for: (1) the imprinter device configured to perform the method; and (2) debonding a stack of two substrates, comprising: providing a first substrate and a second substrate, where each substrate has metal contact bumps, the metal contact bumps are each covered with a graphene sheet portion, the metal contact bumps of the first substrate are in contact with the metal contact bumps of the second substrate, and the first substrate and the second substrate are held together by a removable bonding means; and removing the bonding means, where contact between the metal contact bumps of the first substrate are released from the metal contact bumps of the second substrate, such that the first substrate is released from the second substrate, and the first substrate and the second substrate are fully separated. DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of transferring the sheet of graphene. Silicon wafer (1) Passivation layer (2) Imprinter substrate (10) Graphene sheet portions (15) Ring shaped indentation (17)