▎ 摘　　要

NOVELTY - Chuck assembly (50) comprises a chuck base includes a lower base (51) and an upper base (53) that is on the lower base, ceramic plate (55) on the upper base, an isolator ring (56) enclosing an outer sidewall of the lower base, a focus ring (58) on an edge portion of the lower base and the isolator ring. The focus ring is enclosed an outer sidewall of the upper base, and a pad that is between the edge portion of the lower base and the focus ring. The pad contains a nonmetal conductive material. USE - Chuck assembly used in semiconductor device fabrication system (claimed). ADVANTAGE - The chuck assembly suppresses a plasma arcing phenomenon, and also onfigured to fasten a substrate by using an electrostatic force. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: A semiconductor device fabrication system, comprising: a chamber; a shower head in an upper portion of the chamber; and a chuck assembly in a lower portion of the chamber, the chuck assembly configured to contain a substrate, wherein the chuck assembly includes a chuck base including a lower base and an upper base that is on the lower base, a ceramic plate on the upper base, an isolator ring enclosing an outer sidewall of the lower base, a focus ring on an edge portion of the lower base and the isolator ring such that the focus ring encloses an outer sidewall of the upper base, and a pad that is between the edge portion of the lower base and the focus ring, wherein the pad contains a nonmetal conductive material. A method for fabricating a semiconductor device, which involves: placing a substrate on a chuck assembly; providing a reaction gas on the substrate; and supplying a radio frequency power to produce a plasma on the substrate, where the chuck assembly includes a chuck base includes lower base and an upper base that is on the lower base, a ceramic plate on the upper base, an isolator ring enclosing an outer sidewall of the lower base, a focus ring on an edge portion of the lower base and the isolator ring, the focus ring enclosing an outer sidewall of the upper base, and a pad that is between the edge portion of the lower base and the focus ring, where the pad contains a nonmetal conductive material. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of chuck assembly. 50Chuck assembly 51Lower base 53Upper base 55Ceramic plate 56Isolator ring