▎ 摘　　要

NOVELTY - An ultra-thin-flexible terahertz shielding material preparation method involves growing graphene on surface of metal substrate by performing chemical vapor deposition, coating a layer of transfer medium on surface of the metal substrate, removing material from the metal substrate using etching solution, obtaining graphene supported transfer medium, depositing metal film on polymer substrate, transferring the removed material on surface of the polymer substrate, removing the graphene supported transfer medium, repeating metal film deposition and transferring steps and obtaining layers of assembled metal-graphene composite. USE - Method for preparing ultra-thin-flexible terahertz shielding material that is utilized for aircraft, aerospace, flexible wearable electronics and portable electronic devices (claimed). ADVANTAGE - The method enables preparing highly efficient ultra-thin-flexible terahertz shielding material with 1-100 layers, preferably 1-4 layers, thickness of nm level, high stability and better flexibility. DETAILED DESCRIPTION - An ultra-thin-flexible terahertz shielding material preparation method involves growing graphene on surface of metal substrate by performing chemical vapor deposition, coating a layer of transfer medium on surface of the metal substrate, removing material from the metal substrate using etching solution, obtaining graphene supported transfer medium, depositing metal film on polymer substrate, transferring the removed material on surface of the polymer substrate, removing the graphene supported transfer medium, repeating metal film deposition and transferring steps and obtaining layers of assembled metal-graphene composite, where the method specifically involves cleaning 20-30 mu m copper foil, placing in 1000 degrees C tube furnace under protection of argon, passing hydrogen, annealing, passing methane, growing graphene, natural cooling in presence of argon and hydrogen, spin coating a layer of poly(methyl methacrylate) film on surface of graphene coated copper foil, removing copper using copper sulfate/hydrochloric acid etching solution (200 g/l copper sulfate and concentrated hydrochloric acid in a ratio of 1:1), obtaining graphene supported poly(methyl methacrylate) film, cleaning, depositing copper film on polyimide substrate by vacuum evaporation, transferring the graphene supported poly(methyl methacrylate) film on polyimide based copper film, drying, remove poly(methyl methacrylate) film using acetone, alternately repeating copper film deposition and graphene transferring steps and obtaining layered copper-graphene composite with thickness of 40-160 nm. An INDEPENDENT CLAIM is also included for an ultra-thin-flexible terahertz shielding material prepared by the method.