▎ 摘　　要

NOVELTY - Preparation of graphene high-temperature electric heating film by laser-induced graphene method involves taking polyimide (PI) film, coating thermoplastic polyamic acid on PI film, drying to form semi-cured polyamic acid film, pressing it with copper electrode after imidization treatment to obtain PI film-copper electrode composite layer, applying thermoplastic polyamic acid prepolymer on PI film, drying to form semi-cured polyamic acid film, forming PI-polyamic acid film material with open holes to form PI-copper electrode-polyamic acid membrane material-PI structure, pressing PI-copper electrode-polyamic acid membrane material-PI structure, performing imidization treatment to form PI film-copper electrode-PI material layer, performing laser-induced graphene (LIG) on polyimide material layer to form graphene heating layer pattern to obtain PI film-copper electrode composite layer-patterned graphene layer, and encapsulating protective film on patterned graphene layer. USE - Preparation of graphene high-temperature electric heating film by laser-induced graphene method. DETAILED DESCRIPTION - Preparation of graphene high-temperature electric heating film by laser-induced graphene method, involves (1) taking polyimide (PI) film coating thermoplastic polyamic acid on PI film, drying to form semi-cured polyamic acid film, then pressing it with copper electrode after imidization treatment to obtain PI film-copper electrode composite layer in which the copper electrode is fully or partially embedded in the PI film, (2) taking PI film, applying thermoplastic polyamic acid prepolymer on its surface, drying to form semi-cured polyamic acid film, and forming PI-polyamic acid film material with open holes, and aligning copper electrode in open holes, so that the copper electrode can be exposed through the open holes to form PI-copper electrode-polyamic acid membrane material-PI structure, pressing PI-copper electrode-polyamic acid membrane material-PI structure, performing imidization treatment of the polyamic acid membrane material, so that PI-polyamic acid membrane material is fused to form completed PI material layer and combining to form PI film-copper electrode-PI material layer, (3) performing laser-induced graphene (LIG) processing on polyimide material layer, conducting laser transmission to form graphene heating layer pattern to form PI film-copper electrode composite layer-patterned graphene layer, and (4) encapsulating a protective film layer on the surface of the patterned graphene layer.