▎ 摘　　要

NOVELTY - High-performance antimony tin oxide powder blended silicone resin-polymethyl methacrylate composite material comprises phenyltrimethoxysilane, divinyltetramethyldisiloxane, tetramethyldisiloxane, tetramethyl tetraphenyl cyclotetrasiloxane, tetramethylammonium hydroxide, octamethyl cyclotetrasiloxane, 2-phenyl-3-butyn-2-ol, erucamide, toluene, platinum catalyst, dilute hydrochloric aciddeionized water, methyl methacrylate, silica, graphene, antimony tin oxide powder, silane coupling agent kh550, and benzoyl peroxide. USE - The composite material is useful for light-emitting diode packaging (claimed). ADVANTAGE - The composite material is heat resistant, transparent, antistatic, UV resistant, has good mechanical properties, good optical properties, and is durable. DETAILED DESCRIPTION - High-performance antimony tin oxide powder blended silicone resin-polymethyl methacrylate composite material comprises 70-80 pts. wt. phenyltrimethoxysilane, 0.4-0.5 pts. wt. divinyltetramethyldisiloxane, 0.2-0.3 pts. wt. tetramethyldisiloxane, 10-12 pts. wt. tetramethyltetraphenylcyclotetrasiloxane, 0.2-0.3 pts. wt. tetramethylammonium hydroxide, 12-15 pts. wt. octamethylcyclotetrasiloxane, 3-5 pts. wt. 2-phenyl-3-butyn-2-ol, 0.1-0.2 pts. wt. erucamide, 50-60 pts. wt. toluene, 0.01-0.02 pts. wt. platinum catalyst, 0.5-0.8 pts. wt. 30% dilute hydrochloric acid, 5-8 pts. wt. deionized water, 12-15 pts. wt. methyl methacrylate, 10-12 pts. wt. 20-25% silica, 0.1-0.2 pts. wt. graphene, 3-5 pts. wt. antimony tin oxide powder, 0.1-0.2 pts. wt. silane coupling agent kh550, and 0.01-0.02 pts. wt. benzoyl peroxide. AN INDEPENDENT CLAIM is also included for preparing high-performance antimony tin oxide powder blended silicone resin-polymethyl methacrylate composite material, comprising (i) dehydrating tetramethyltetraphenylcyclotetrasiloxane, octamethylcyclotetrasiloxane in vacuum, adding 0.2-0.3 pts. wt. divinyltetramethyldisiloxane and tetramethylammonium hydroxide, heating at 90-100 degrees C in nitrogen atmosphere, reacting for 6-8 hours, heating at 160-180 degrees C for 20-30 minutes, reducing the pressure to 0.05-0.095 MPa, evaporating vinyl phenyl silicone under low flame, (ii) adding 20-30 pts. wt. phenyltrimethoxysilane and tetramethyldisiloxane, 0.1-0.2 pts. wt. dilute hydrochloric acid, 1-2 pts. wt. deionized water, mixing, heating at 70-80 degrees C, stirring for 4-5 hours, adding 15-20 pts. wt. toluene, heating at 100 degrees C such that the excess deionized water is evaporated completely, evaporating low-boiling substances under reduced pressure of 0.05-0.1 MPa to obtain a hydrogen-containing silicone reserve, (iii) mixing the remaining phenyltrimethoxysilane, silane, divinyltetramethyldisiloxane, dilute hydrochloric acid, deionized water, heating at 70-80 degrees C for 3-4 hours, stirring, adding remaining toluene, heating at 100 ?OC, gradually evaporating excess deionized water, evaporating low-boiling substances under reduced pressure of 0.05-0.1 MPa to obtain vinyl silicone reserve, (iv) ultrasonic dispensing antimony tin oxide powder, graphene into the silica sol, dehydrating and drying by heating, mixing the resultant powder with a silane coupling agent kh550, (v) adding the products obtained in step (i), step (ii), step (iii), step (iv), and other remaining materials into the reaction vessel, stirring, mixing, degassing, heating at 70-80 degrees C, curing for 1.5-2 hours, heating at 140-150 degrees C with the heat rate of 5 degrees C/minute, curing, and holding for 0.5-1 hour.