• 专利标题:   Conductive adhesive film for printed circuit board, has conductor layer whose lower surface is provided with large size conductive particle upper glue film layer and large size conductive particle lower glue film layer.
  • 专利号:   CN113409993-A, CN113409993-B
  • 发明人:   LIANG J, ZENG Z, HUANG H, DU J
  • 专利权人:   DONGGUAN YNTECH CO LTD
  • 国际专利分类:   H01B005/14, H01R004/04, H01B001/22, H01B001/24, H05K001/02, B32B015/16, B32B015/04
  • 专利详细信息:   CN113409993-A 17 Sep 2021 H01B-005/14 202187 Pages: 9 Chinese
  • 申请详细信息:   CN113409993-A CN10710077 25 Jun 2021
  • 优先权号:   CN10710077

▎ 摘  要

NOVELTY - The film has a conductor layer whose lower surface is provided with a large size conductive particle upper glue film layer and a large size conductive particle lower glue film layer. An outer surface of the large size conductive particle upper glue film layer is provided with a small size conductive particle upper glue film layer. An outer surface of the large size conductive particle lower glue film layer is provided with a small size conductive particle lower glue film layer, where the conductive particles in the small-size conductive particle upper glue film layer and the small-size conductive particle lower glue film layer are mixture of metal particles and graphene. USE - Conductive adhesive film for use in a printed circuit board (claimed). ADVANTAGE - The conductive film has better adhesive stability and conductive stability. DESCRIPTION OF DRAWING(S) - The drawing shows a front view of a conductive adhesive film for use in a printed circuit board.