• 专利标题:   Low temperature curing and high thermal conductivity one-component carbon-paste adhesive contains composite-type epoxy resin, nano graphene or micron colloidal graphite, coupling agent, active diluting agent and accelerating agent.
  • 专利号:   CN105199645-A
  • 发明人:   CHEN Y, GAN Q, GUO Y, LIN Y
  • 专利权人:   XIAMEN TAIQILIFEI ELECTRONIC TECHNOLOGY
  • 国际专利分类:   C09J011/04, C09J011/06, C09J011/08, C09J163/00
  • 专利详细信息:   CN105199645-A 30 Dec 2015 C09J-163/00 201612 Pages: 9 English
  • 申请详细信息:   CN105199645-A CN10734395 03 Nov 2015
  • 优先权号:   CN10734395

▎ 摘  要

NOVELTY - A low temperature curing and high thermal conductivity one-component carbon-paste adhesive comprises 50-80 wt.% composite-type epoxy resin, 5-30 wt.% nano graphene or micron colloidal graphite, 5-15 wt.% curing agent, 0.1-2 wt.% coupling agent, 1-15 wt.% active diluting agent, 1-10 wt.% active toughening agent and 0.5-3 wt.% accelerating agent. USE - Low temperature curing and high thermal conductivity one-component carbon-paste adhesive (claimed). ADVANTAGE - The one-component carbon-paste adhesive has excellent low temperature curing properties, thermal conductivity, stability and toughness. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of low temperature curing and high thermal conductivity one-component carbon-paste adhesive.