▎ 摘　　要

NOVELTY - Copper foil comprises 120-125 pts. wt. methyl vinyl MQ high viscosity silicone resin, 75-87 pts. wt. graphene powder, 1-3 pts. wt. cadmium oxide, 2-4 pts. wt. antimony oxide, 1-3 pts. wt. molybdenum trioxide, 324-335 pts. wt. copper powder, 2-4 pts. wt. nano-beryllium, 38-77 pts. wt. nano-aluminum nitride, 55-60 pts. wt. aluminum powder, 3-5 pts. wt. magnesium silicide, 1-3 pts. wt. scandium oxide, 20-22 pts. wt. nano-titanium and 7-9 pts. wt. nano-zirconium. USE - The copper foil is used for electronic device. ADVANTAGE - The copper foil has high heat dissipation effect and excellent thermal conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the copper foil, involving (a) adding copper powder, nano-beryllium, nano-aluminum nitride, aluminum powder, magnesium silicide, scandium oxide, nano-titanium and nano-zirconium to three-dimensional motion mixer for mixing treatment, and uniformly mixing to obtain mixture, (b) sintering obtained mixture in sintering manner, and sintering blank at 900-1000 degrees C under pressure of 60-90 MPa for 60-90 minutes to obtain blank product, (c) pressing obtained blank product to thin film using calender to obtain copper foil substrate, and (d) adding graphene powder, cadmium oxide, antimony oxide and molybdenum trioxide to methyl vinyl MQ high-viscosity silicone resin, uniformly stirring, smearing the mixture on surface of copper foil substrate, so that the copper foil substrate is covered to obtain copper foil.