▎ 摘　　要

NOVELTY - The package has a flexible carbon nanotube sheet (5) consisting of graphene (8) and carbon nanotube bundle (4) on the mounting surface of electronic device chip (6). The gap between the carbon nanotubes in the bundle is filled with a medium such as conductive resin or non-electroconductive resin. A mother base material (2) of package is coated with gold, silver, copper, molybdenum, aluminum, titanium, tantalum, chromium, cobalt, nickel, tungsten or iron. USE - Package for mounting electronic device chip e.g. wireless amplifier and high power amplifier for mobile phone, high frequency semiconductor element for server personal computer (PC), vehicle-mounted semiconductor integrated circuit (IC) device, electric vehicle motor drive transistor (all claimed). ADVANTAGE - The heat radiation efficiency between the package base and electronic device chip, is improved by using flexible carbon nanotube sheet. DESCRIPTION OF DRAWING(S) - The drawing shows an explanatory view of the package. (Drawing includes non-English language text) Mother base material (2) Carbon nanotube (4) Carbon nanotube sheet (5) Electronic device chip (6) Graphene (8)