• 专利标题:   Thermal management assembly for transferring heat away from heat source, comprises first substrate, second substrate, bulk graphene material disposed between first and second substrates, and thermal bond layer.
  • 专利号:   WO2014052282-A1, EP2901826-A1, US2015253089-A1, CN104813751-A, JP2015532531-W, JP6529433-B2
  • 发明人:   FAN W, LIU X, MARINER J, RAPE A
  • 专利权人:   MOMENTIVE PERFORMANCE MATERIALS INC, MOMENTIVE PERFORMANCE MATERIALS INC, FAN W, LIU X, MARINER J, RAPE A, GENERAL ELECTRIC CO, MOMENTIVE PERFORMANCE MATERIALS INC
  • 国际专利分类:   B32B015/04, H05K003/10, H05K007/20, F28F021/02, F28F021/08, H01L023/373, H01L023/36
  • 专利详细信息:   WO2014052282-A1 03 Apr 2014 H05K-003/10 201428 Pages: 29 English
  • 申请详细信息:   WO2014052282-A1 WOUS061335 24 Sep 2013
  • 优先权号:   US705362P, US14431123

▎ 摘  要

NOVELTY - Thermal management assembly comprises a first substrate; a second substrate; a bulk graphene material disposed between the first and second substrates; and a thermal bond layer disposed between (a) a first surface of the bulk graphene layer and the first substrate, and (b) a second surface of the bulk graphene layer and the second substrate, the thermal bond layers comprising a metal-based material comprising an agent that is reactive with the graphene to form a carbide. USE - The thermal management assembly is useful for transferring heat away from heat source. ADVANTAGE - The thermal management assembly exhibits low thermal interface resistance. It can even provide a thermal interface that is orders of magnitude lower than conventional thermal interface assemblies. DETAILED DESCRIPTION - Thermal management assembly comprises a first substrate; a second substrate; a bulk graphene material disposed between the first and second substrates; and a thermal bond layer disposed between (a) a first surface of the bulk graphene layer and the first substrate, and (b) a second surface of the bulk graphene layer and the second substrate, the thermal bond layers comprising a metal-based material comprising an agent that is reactive with the graphene to form a carbide; or thermal management assembly comprises a thermally conductive core material disposed between a first substrate and a second substrate, and a thermal bond layer disposed between adjacent surfaces of the first substrate and the core material and adjacent surfaces of the second substrate and the core material, where the thermal management assembly has a thermal resistance of less than 5x10-6 K-m2/W at each interface between the substrates and the core; or thermal management assembly comprises a bulk graphene core material having a first surface and a second surface opposite the first surface; and a first outer layer disposed on the first surface of the core material; and a second outer layer disposed on the second surface of the core material; where the first outer layer and the second outer layer are independently formed from a metal-based material comprising an agent that is reactive with graphene to form a carbide. An INDEPENDENT CLAIM is included for an apparatus comprising a heat generating component and the thermal management assembly disposed adjacent the heat generating component such that heat from the heat generating component can be transferred through the thermal management assembly.