▎ 摘　　要

(CN214176013-U) NOVELTY - The utility model claims a semiconductor structure. The semiconductor structure comprises a bare chip, a radiating component and a nano structure, the bare chip comprises a circuit set on one surface of the bare chip or in the inner part, the circuit makes the bare chip have specific function; a radiating component is attached to the bare chip through an adhesive set between the surface of the bare chip and the radiating component; A nano structure is set between the adhesive and the die, configured to transmit the heat from the die to the radiating member, from the adhesive towards the surface of the die and is with the surface of the die contact DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a semiconductor structure. Semiconductor structure (100) Die (101) heat dissipation part (102) Adhesive (103) Nanostructure (104)