▎ 摘　　要

NOVELTY - A modified copper powder conductive adhesive comprises 2.0-8.0 wt.% curing agent, 1.0-10.0 wt.% diluent, 0.05-3.5 wt.% accelerant, 0.01-1.0 wt.% plasticizer, 15.0-45.0 wt.% graphene-modified copper powder and balance organic silicone resin. USE - Modified copper powder conductive adhesive. ADVANTAGE - The adhesive has better conductivity, moisture absorptivity and transfer performance. It also has good practicability and reduced cost. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the preparation of modified copper powder conductive adhesive comprising stirring organic silicone resin, curing agent, accelerant and plasticizer in vacuum planetary stirrer at 0.065-0.099 MPa at rotation speed of 25 plus minus 5 revolutions/minute (rpm), adding graphene-modified copper powder and stirring at 20 plus minus 5 rpm.