▎ 摘　　要

NOVELTY - The carbon paste through-hole circuit board has a circuit substrate (1) arranged in the middle. The upper and lower outer surfaces of the circuit board, are attached with prepreg boards (2). The upper and lower outer surfaces of the prepreg board, are attached with honeycomb heat dissipation sheets (3). The upper and lower outer surfaces of the honeycomb heat dissipation sheet, are provided with copper foil boards (4). The copper foil board is electrically connected through a carbon paste board (6). The carbon paste board is provided with a carbon paste through hole (7). A heat dissipation hole (12) is provided around the carbon paste through hole. The blind grooves (10) are opened on the copper foil board. USE - Carbon paste through-hole circuit board. ADVANTAGE - The board improves radiating effect, avoids circuit board to damage structure of the circuit board due to heat collecting, utilizes resin with good elasticity to prepare the substrate and the semi-solidified sheet board by adding the blind groove, improves flexibility of the circuit board, and changes elasticity and flexibility of the circuit board. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing a carbon paste through-hole circuit board. DESCRIPTION OF DRAWING(S) - The drawing shows the cross-sectional view of the carbon paste through-hole circuit board. Circuit substrate (1) Prepreg board (2) Heat dissipation sheet (3) Copper foil board (4) Carbon paste board (6) Carbon paste through hole (7) Blind groove (10) Heat dissipation hole (12)