• 专利标题:   Contact of electronic package, such as semiconductor device, has barrier layer comprising graphene which separates first layer comprising conductor and a second layer comprising conductor or semiconductor.
  • 专利号:   WO2013096273-A1, US2014339700-A1
  • 发明人:   REN F, PEARTON S J, KIM J, KIM H
  • 专利权人:   UNIV FLORIDA RES FOUND INC, REN F, PEARTON S J, KIM J, KIM H
  • 国际专利分类:   H01L021/60, H01L023/48, H01L021/285, H01L021/768, H01L023/532
  • 专利详细信息:   WO2013096273-A1 27 Jun 2013 H01L-023/48 201344 Pages: 25 English
  • 申请详细信息:   WO2013096273-A1 WOUS070278 18 Dec 2012
  • 优先权号:   US577870P, US14367637

▎ 摘  要

NOVELTY - The contact includes: a first layer comprising a conductor; a second layer comprising a second conductor or a semiconductor; and a barrier layer comprising graphene. The barrier layer separates the first layer and the second layer. USE - Contact of electronic package, such as semiconductor device (claimed). ADVANTAGE - Contacts with the graphene barrier layer display enhanced reliability as the graphene layer inhibits diffusion and reaction between the layers contacting the barrier layer. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method to prepare a contact of a semiconductor device. DESCRIPTION OF DRAWING(S) - The drawing shows microscopy images of the top surfaces of a gold/nickel/silicon contact and a gold/graphene/nickel/silicon contact after annealing at 500, 600 or 700 degrees Celsius.